The EXTOLL GmbH was established in 2011 as a spin-off of the University of Heidelberg. The company develops interconnect technology (IP, hardware, firmware, management software und middleware) for high-performance computing applications. Due to close relationships with Intel and other companies a highly elaborated and efficient technology could be developed that perfectly links to current and upcoming computer architectures.
The research and development team at EXTOLL, which is still closely connected to the University of Heidelberg, has a vast experience and knowledge in developing the complete stack for communication in HPC, from low-level ASIC and hardware design, PCB design, manufacturing to system architecture, verification and necessary software development.

DEEP-EST

In the DEEP-EST project EXTOLL provided the fast low-latency interconnect ASIC Tourmalet for the Extreme Scale Booster and some other modules of the heterogeneous system. Furthermore, EXTOLL specified and developed the fabri3 interconnect and the required firmware/software to operate the network.

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